We offer finishing processes such as grinding, lapping and hard milling to meet the highest standards of flatness, dimensional accuracy and surface quality. Our specialized skilled workers work under climate-controlled conditions on modern machines – so that we can reliably achieve surface accuracies of < 2µ even with demanding geometries and materials. In lapping and polishing lapping, we have a large machine park, in-depth experience and a technological edge that positions us as a leader in sectors with the most demanding component requirements, such as semiconductors or the optical industry. We also offer customized lasering of components.
One of SCHAEFER’s core competencies is lapping and polishing lapping. We have decades of experience in the production of high-precision surfaces with a flatness of up to 2µ and a roughness of up to 0.2. Our key to success: a highly qualified team with many years of experience in surface finishing. This is where state-of-the-art technology meets craftsmanship and precision. Our extensive machinery includes lapping and polishing machines up to 900 in diameter – opreated in separate, air-conditioned production rooms. This enables us to manufacture both individual parts and series parts in a replicable way and to the highest quality.
We offer production capacities in the areas of grinding, lapping, abrasive blasting/trovalizing, hard milling and lasering. This enables us to realize the highest form and position tolerances and flatness up to 2µ with repetition accuracy.
